The End of Throttling? Samsung’s Radical “Side-by-Side” Plan to Save Exynos

The article discusses Samsung’s reported move from PoP stacking to a side-by-side SoC-and-memory layout for next-generation Exynos chips to reduce heat buildup, mitigate throttling, and improve sustained performance, especially for gaming and AI workloads. While this approach enables direct heat dissipation and better thermals—similar to Apple’s M-series strategy—it increases motherboard footprint and may reduce battery capacity, creating design trade-offs as Samsung aims to restore Exynos competitiveness against TSMC-fabricated rivals, potentially around 2026–2027.