HBM 열기가 거세지자, SK 하이닉스가 냉각에 나섰다
ID: 0449500e-e302-54c9-836c-463cd8925ac6
STIX ID: report--0449500e-e302-54c9-836c-463cd8925ac6
Feed Name: CIO Security
**Executive summary:** SK hynix announced a new integrated HBM (iHBM) design that implements cooling into the D2D PHY using Integrated Cooling Elements (ICE), targeting a ~30% reduction in thermal resistance for next-generation HBM5 products planned from 2029 onward.
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